Bergquist GapPad3000S30柔软有基材间隙填充导热材料

材料生产商：美国贝格斯（BERGQUIST）公司研发产品

GapPad3000S30可供规格：

厚度(Thickness)：0.25mm 0.51mm 1.02mm 1.52mm 2.03mm 2.54mm 3.18mm

片材(Sheet)： 8”×16”（203×406mm)

卷材(Roll)：无

导热系数(Thermal Conductivity)：3.0W/m-k

基材(Reinfrcement Carrier)：玻璃纤维

胶面(Glue)：双面自带粘性

颜色(Color)：浅绿色

包装(Pack)：美国原装包装

抗击穿电压(Dielectic Breakdown Voltage)（Vac）:＞3000

持续使用温度（Continous Use Temp）：-60°~200°

GapPad3000S30应用材料特性：

GapPad3000S30在非常低的压力下，低的S系列热阻，高的贴服性，S系列软度。针对低应力应用设计

玻纤增强，提高加工性能和搞斯裂性

Gap Pad 3000S30 is a soft gap filling material rated at a thermal conductivity of 3 W/m-K. The material offers exceptional thermal performance at low pressures due to an allnew 3 W/m-K filler package and low-modulus resin formulation. It is reinforced to enhance material handling, puncture, shear and tear resistance. It is well suited for high performance, low-stress applications that typically use fixed standoff or clip mounting. Gap Pad 3000S30 maintains a conformable yet elastic nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography.

Gap Pad 3000S30 is offered with natural inherent tack on both sides of the material, eliminating the need for thermally-impeding adhesive layers.The material’s natural inherent tack allows for stick-in-place characteristics during assembly. Gap Pad 3000S30 is supplied with protective liners on both sides.The top side has reduced tack for ease of handling.

GapPad3000S30材料应用：

处理器，服务器S-RAMS,大容量存储驱动器，有线/无线通讯硬件，笔记本电脑，BGA封装，功率转换器

GapPad3000S30技术优势分析：

GapPad3000S30导热界面材料系列以更好的贴服性，更高的导热性能及易于应用来满足电子工业对导热界面材料的日益增长的需要；在凹凸不平的表面，空气间隙和表面粗糙的散热器与电子元器件之间，广泛的GapPad3000S30提供一个有效的导热界面。